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Utilisation of amorphous semiconductor switching materials for programmable interconnections and circuits

Ghare, DB and Prakash, S and Oak, S (2000) Utilisation of amorphous semiconductor switching materials for programmable interconnections and circuits. In: 2000 HD International Conference on High-Density Interconnect and Systems Packaging, 25-28 April 2000, Denver, CO, USA, pp. 232-234.

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Abstract

Several amorphous semiconductor material compositions are well known to exhibit I-V switching characteristics which are useful for numerous applications. The application of thin-thick films of such materials for programmable switching interconnections and circuits is a new area attracting attention around the world. This article presents information on the properties of such material compositions relevant for programmable switching interconnections as well as for buried R/C/L circuit element fabrication along with some results by the authors on chalcogenide based amorphous semiconductor material compositions

Item Type: Conference Paper
Additional Information: Copyright of this article belongs to IMAPS - International Microelectronics & Packaging Society
Keywords: integrated circuit interconnections;integrated circuit;packaging;multichip modules;programmable circuits;RC circuits;semiconductor device packaging;semiconductor;switches;semiconductor thin films;switching
Department/Centre: Division of Electrical Sciences > Electrical Communication Engineering
Date Deposited: 27 Jul 2007
Last Modified: 27 Aug 2008 12:43
URI: http://eprints.iisc.ernet.in/id/eprint/10357

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