Kshirsagar, Bapurao J and Nagaraju, J and Krishna Murthy, MV (2003) Thermal contact conductance of silicon nitride-coated OFHC copper contacts. In: Experimental Heat Transfer, 16 (4). pp. 273-279.
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An experimental investigation was conducted to study the degree to which the thermal contact conductance at the interface of OFHC copper contacts could be reduced through the use of sputtered silicon nitride films. The experimental results are presented graphically to illustrate the dimensionless thermal contact conductance of both coated and uncoated OFHC copper contacts as a function of contact pressure. Silicon nitride coating on OFHC copper reduces the contact conductance by almost four times.
|Item Type:||Journal Article|
|Additional Information:||Copyright of this article belongs to Taylor and Francis Group.|
|Department/Centre:||Division of Physical & Mathematical Sciences > Instrumentation and Applied Physics (Formally ISU)|
|Date Deposited:||13 Apr 2007|
|Last Modified:||09 Jan 2012 06:34|
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