ePrints@IIScePrints@IISc Home | About | Browse | Latest Additions | Advanced Search | Contact | Help

Influence of Solvents on the MWCNT/Adhesive Grade Epoxy Nanocomposites Preparation

Sharma, SC and Sheshadri, TS and Krishna, M and Murthy, HN Narasimha and Jose, Jeena (2009) Influence of Solvents on the MWCNT/Adhesive Grade Epoxy Nanocomposites Preparation. In: Journal of Reinforced Plastics and Composites, 28 (22). pp. 2805-2812.

Full text not available from this repository.
Official URL: http://jrp.sagepub.com/cgi/content/abstract/28/22/...

Abstract

In this article, the effect of two solvents, namely dimethyl formamide (DMF) and N-methyl pyrrolidone (NMP), on the dispersion effectiveness and the resulting electrical and mechanical properties of multi-walled carbonanotubes (MNCNT) filled structural adhesive grade epoxy nanocomposites was studied. The solvents were used mainly to reduce the viscosity of the resin system to effectively disperse the nanofiller. The dispersion was carried out under vacuum using high energy sonic waves. SEM was undertaken to study the dispersion effectiveness. Electrical resistivity, tensile properties, and glass transition of the nanocomposites were studied. Between DMF and NMP, the former proved better in terms of dispersion effectiveness and the resulting electrical and mechanical properties of the nanocomposites. Addition of MWCNT into AV138M resulted in an increase in glass transition temperature irrespective of the solvent used and in both cases percolation threshold was found with respect to reduction in electrical resistivity of the nanocomposites. Less agglomeration and hence better interaction between CNT and epoxy was observed in the samples prepared using DMF compared with that using NMP.

Item Type: Journal Article
Additional Information: Copyright for this article belongs to SAGE Publications LTD.
Keywords: MWCNT; DMF; NMP; structural adhesive; electrical properties
Department/Centre: Division of Mechanical Sciences > Aerospace Engineering (Formerly, Aeronautical Engineering)
Date Deposited: 04 Dec 2009 06:47
Last Modified: 04 Dec 2009 06:47
URI: http://eprints.iisc.ernet.in/id/eprint/25058

Actions (login required)

View Item View Item