Khandelwal, R and Kishen, JMC (2009) Computation of Thermal Stress Intensity Factors for Bimaterial Interface Cracks Using Domain Integral Method. In: Journal of Applied Mechanics, 76 (4).
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The concept of domain integral used extensively for J integral has been applied in this work for the formulation of J(2) integral for linear elastic bimaterial body containing a crack at the interface and subjected to thermal loading. It is shown that, in the presence of thermal stresses, the J(k) domain integral over a closed path, which does not enclose singularities, is a function of temperature and body force. A method is proposed to compute the stress intensity factors for bimaterial interface crack subjected to thermal loading by combining this domain integral with the J(k) integral. The proposed method is validated by solving standard problems with known solutions.
|Item Type:||Journal Article|
|Additional Information:||Copyright of this article belongs American Society of Mechanical Engineers.|
|Department/Centre:||Division of Mechanical Sciences > Civil Engineering|
|Date Deposited:||05 Mar 2010 05:47|
|Last Modified:||19 Sep 2010 05:56|
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