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Microstructural stability and creep in nanocrystals

Chokshi, Atul H (2008) Microstructural stability and creep in nanocrystals. In: 4th International Conference on Nanomaterials by Severe Plastic Deformation, AUG 18-22, 2008, Goslar.

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Official URL: http://www.scientific.net/MSF.584-586.876

Abstract

Microstructural stability is an important consideration during high temperature deformation and processing of nanomaterials. We will address issues relating to triple junctions in limiting grain growth during creep as well as densification. Although early studies on deformation have considered diffusion creep as a possible rate controlling deformation mechanism in nanocrystals, a critical inspection of available data indicates that there is no strong evidence for conventional diffusion creep in such materials. The possibility of diffusion creep by rapid diffusion along triple junctions will be analyzed, and interface controlled diffusion creep will also be discussed critically. It is shown that the critical grain size for dislocation activity is similar to that for occurrence of conventional diffusion creep.

Item Type: Conference Paper
Additional Information: Copyright of this article belongs to Trans Tech Publications Inc.
Keywords: nanocrystal;grain growth;creep;dislocation;diffusion.
Department/Centre: Division of Mechanical Sciences > Materials Engineering (formerly Metallurgy)
Date Deposited: 25 Mar 2010 07:34
Last Modified: 25 Mar 2010 07:34
URI: http://eprints.iisc.ernet.in/id/eprint/26512

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