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On the effect of stacking fault energy on the thermal activation of attractive juntions in the low-temperature creep of F.C.C. metals

Prasad, YVRK and Sastry, DH and Vasu, KI (1970) On the effect of stacking fault energy on the thermal activation of attractive juntions in the low-temperature creep of F.C.C. metals. In: Scripta Metallurgica, 4 (3). pp. 219-220.

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Official URL: http://dx.doi.org/10.1016/0036-9748(70)90196-1
Item Type: Journal Article
Additional Information: Copyright of this article belongs to Elsevier Science.
Department/Centre: Division of Mechanical Sciences > Materials Engineering (formerly Metallurgy)
Date Deposited: 03 Jun 2010 07:35
Last Modified: 19 Sep 2010 06:08
URI: http://eprints.iisc.ernet.in/id/eprint/28232

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