Singh, B and Garg, S and Rathore, J and Moore, R and Ravishankar, N and Interrante, L and Ramanath, Ganpati (2010) Ring-Opening-Induced Toughening of a Low-Permittivity Polymer-Metal Interface. In: Acs Applied Materials & Interfaces, 2 (5). pp. 1275-1280.
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Integrating low dielectric permittivity (low-k) polymers to metals is an exacting fundamental challenge because poor bonding between low-polarizability moieties and metals precludes good interfacial adhesion. Conventional adhesion-enhancing methods such as using intermediary layers are unsuitable for engineering polymer/metal interfaces for many applications because of the collateral increase in dielectric permittivity. Here, we demonstrate a completely new approach without surface treatments or intermediary layers to obtain an excellent interfacial fracture toughness of > 13 J/m(2) in a model system comprising copper. and a cross-linked polycarbosilane with k similar to 2.7 obtained by curing a cyclolinear polycarbosilane in air.Our results suggest that interfacial oxygen catalyzed molecularring-opening and anchoring of the opened ring moieties of the polymer to copper is the main toughening mechanism. This novel approach of realizing adherent low-k polymer/metal structures without intermediary layers by activating metal-anchoring polymer moieties at the interface could be adapted for applications such as device wiring and packaging, and laminates and composites.
|Item Type:||Journal Article|
|Additional Information:||Copyright of this article belongs to American Chemical Society.|
|Keywords:||low k;polymer;interface toughening;ring-opening; carbosilane;copper|
|Department/Centre:||Division of Chemical Sciences > Materials Research Centre|
|Date Deposited:||14 Jun 2010 07:28|
|Last Modified:||19 Sep 2010 06:08|
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