Ravichandran, N and Prasad, YVRK (1993) Characteristics of Dynamic Recrystalization Domain in the Processing Map for Hot-Working of OFHC Coper. In: Zeitschrift für Metallkunde, 84 (2). pp. 132-139.Full text not available from this repository.
The constitutive flow behaviour of OFHC copper under working conditions is studied using hot compression in the temperature range 650 to 900-degrees-C and strain rate range 0.001 to 100 s-1. The variation of the efficiency of power dissipation given by [2m/(m + 1)] (where m is the strain rate sensitivity) with temperature and strain rate is represented in the form of a power dissipation map and interpreted on the basis of the Dynamic Materials Model. The map prominently exhibited a domain centered at 850-degrees-C and 100 s-1 with a peak efficiency of 35 %. On the basis of the correlation of variations of grain size, efficiency of power dissipation and hot workability with temperature, the domain is identified to represent dynamic recrystallization (DRX).
|Item Type:||Journal Article|
|Additional Information:||Copyright of this article belongs to Carl Hanser Verlag.|
|Department/Centre:||Division of Mechanical Sciences > Materials Engineering (formerly Metallurgy)|
|Date Deposited:||02 Feb 2011 07:20|
|Last Modified:||02 Feb 2011 07:20|
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