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Sensing of delaminations in composite laminates using embedded magnetostrictive particle layers

Krishnamurthy, AV and Anjanappa, M and Wang, Z and Chen, X (1999) Sensing of delaminations in composite laminates using embedded magnetostrictive particle layers. In: Journal of Intelligent Material Systems and Structures, 10 (10). 825-835 .

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Official URL: http://jim.sagepub.com/content/10/10/825.abstract

Abstract

This is an exploratory study to illustrate the feasibility of detecting delamination type of damage in polymeric laminates with one layer of magnetostrictive particles. One such beam encircled with excitation and sensing coils is used for this study. The change in stress gradient of the magnetostrictive layer in the vicinity of delamination shows up as a change in induced voltage in the sensing coil, and therefore provides a means to sense the presence of delamination. Recognizing the constitutive behavior of the Terfenol-D material is highly nonlinear, analytical expressions for the constitutive relations are developed by using curve fitting techniques to the experimental data. Analytical expressions that relate the applied excitation field with the stress and magnetic flux densities induced in the magnetostrictive layer are developed. Numerical methods are used to find the relative change in the induced voltage in the sensing coil due to the presence of delamination. A typical example of unidirectional laminate, with embedded delaminations, is used for the simulation purposes. This exploratory study illustrates that the open-circuit voltage induced in the sensing coil changes significantly (as large of 68 millivolts) with the occurrence of delamination. This feature can be exploited for device off-line inspection techniques and/or linking monitoring procedures for practical applications.

Item Type: Journal Article
Additional Information: Copyright of this article belongs to Sage Publications.
Department/Centre: Others
Date Deposited: 30 Jun 2011 08:41
Last Modified: 30 Jun 2011 08:41
URI: http://eprints.iisc.ernet.in/id/eprint/38761

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