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Nanoindentation studies in NiTi films deposited on Si wafer

Kumar, A and Sharma, Sudhir Kumar and Kamat, Samir V and Mohan, S (2011) Nanoindentation studies in NiTi films deposited on Si wafer. In: International Journal of Surface Science and Engineering, 5 (1, Sp.). pp. 63-74.

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Official URL: http://www.inderscience.com/search/index.php?actio...

Abstract

Nanoindentation tests were carried out at different locations in a Ti rich NiTi film deposited on a 3 `' silicon wafer by dc magnetron sputtering. The purpose of doing nanoindentation at different locations was to check the uniformity of the sample with respect to its mechanical behaviour and shape memory effect. The results showed that elastic modulus and hardness measured by nanoindentation was similar at different locations in the 3 `' wafer. Nanoindcntation coupled with depth profiling of residual indents using AFM also showed that the extent of shape memory recovery obtained by heating the film above its martensite to austcnite phase transformation temperature was also similar at different locations in the 3 `' wafer. However, the measured recovery ratio was lower than that predicted from theoretical calculations for indents made using Berkovich indenter. The results showed that the deposition process resulted in a NiTi film with uniform composition, mechanical properties and shape memory behaviour.

Item Type: Journal Article
Additional Information: Copyright of this article belongs to Inderscience Publishers.
Keywords: NiTi film;nanoindentation;shape memory effect;recovery ratio
Department/Centre: Division of Physical & Mathematical Sciences > Instrumentation and Applied Physics (Formally ISU)
Date Deposited: 04 Jul 2011 08:07
Last Modified: 04 Jul 2011 08:07
URI: http://eprints.iisc.ernet.in/id/eprint/38884

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