Chakraborty, Suman and Dutta, Pradip (2003) Analytical solutions for heat transfer during cyclic melting and freezing of a phase change material used in electronic or electrical packaging. In: Journal of Electronic Packaging, 125 (1). pp. 126-133.
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In this paper we develop an analytical heat transfer model, which is capable of analyzing cyclic melting and solidification processes of a phase change material used in the context of electronics cooling systems. The model is essentially based on conduction heat transfer, with treatments for convection and radiation embedded inside. The whole solution domain is first divided into two main sub-domains, namely, the melting sub-domain and the solidification sub-domain. Each sub-domain is then analyzed for a number of temporal regimes. Accordingly, analytical solutions for temperature distribution within each subdomain are formulated either using a semi-infinity consideration, or employing a method of quasi-steady state, depending on the applicability. The solution modules are subsequently united, leading to a closed-form solution for the entire problem. The analytical solutions are then compared with experimental and numerical solutions for a benchmark problem quoted in the literature, and excellent agreements can be observed.
|Item Type:||Journal Article|
|Additional Information:||Copyright of this article belongs to The American Society of Mechanical Engineers.|
|Keywords:||packaging;cooling;melting;solidification;freezing;heat conduction;convection;heat radiation;temperature distribution|
|Department/Centre:||Division of Mechanical Sciences > Mechanical Engineering|
|Date Deposited:||03 Aug 2011 10:14|
|Last Modified:||03 Aug 2011 10:14|
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