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Printed wiring board (PWD) miniaturization by embedded passives and sequential build-up (SBU) process methodology using microvia interconnects

Balakrishnan, PS and Arockiasamy, P and Vasanta, KB and Mahesh, GV (2008) Printed wiring board (PWD) miniaturization by embedded passives and sequential build-up (SBU) process methodology using microvia interconnects. In: Proceedings of 24th Annual Inhouse Symposium on Space Science and Technology , January 2008, Bangalore.

Full text not available from this repository.
Item Type: Conference Paper
Department/Centre: Division of Mechanical Sciences > Centre for Sustainable Technologies (formerly ASTRA)
Date Deposited: 27 Sep 2011 07:21
Last Modified: 27 Sep 2011 07:21
URI: http://eprints.iisc.ernet.in/id/eprint/40894

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