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Printed Wiring Board (PWB) Miniaturization by Embedded Passives and Sequential Build-Up (SBU) Process Methodology using Microvia Interconnects

Balakrishnan, PS and Vasanta, KB and Malini, A and Mahesh, GV (2007) Printed Wiring Board (PWB) Miniaturization by Embedded Passives and Sequential Build-Up (SBU) Process Methodology using Microvia Interconnects. In: Proceedings of the Conference on Advances in Space Science and Technology (CASST-07) Proceedings of the Conference on Advances in Space Science and Technology (CASST-07), Bangalore, January 29-31, 2007, Bangalore.

Full text not available from this repository.
Item Type: Conference Paper
Department/Centre: Division of Electrical Sciences > Electronic Systems Engineering (Formerly, (CEDT) Centre for Electronic Design & Technology)
Date Deposited: 11 Oct 2011 09:18
Last Modified: 11 Oct 2011 09:18
URI: http://eprints.iisc.ernet.in/id/eprint/41357

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