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The Use of Jk Integral in Thermal Stress Crack Problems of Bi-material Interface

Khandelwal, Ratnesh and Kishen, Chandra JM (2006) The Use of Jk Integral in Thermal Stress Crack Problems of Bi-material Interface. In: Second International Congress on Computational Mechanics and Simulation, Dec 2006, IIT, Guwahati.

Full text not available from this repository.
Item Type: Conference Paper
Department/Centre: Division of Mechanical Sciences > Civil Engineering
Date Deposited: 22 Nov 2011 08:23
Last Modified: 22 Nov 2011 08:23
URI: http://eprints.iisc.ernet.in/id/eprint/42254

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