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Microstructure and damping behaviour of consolidated magnesium chips

Anilchandra, AR and Surappa, MK (2012) Microstructure and damping behaviour of consolidated magnesium chips. In: Materials Science and Engineering: A, 542 . pp. 94-103.

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Official URL: http://dx.doi.org/10.1016/j.msea.2012.02.038

Abstract

Chips produced by turning a commercial grade pure magnesium billet were consolidated by solid state recycling technique of cold compaction followed by hot extrusion. The cold compacted billets were extruded at four different temperatures: 250 degrees C, 300 degrees C, 350 degrees C and 400 degrees C. For the purpose of comparison, cast magnesium (pure) billets were extruded under similar conditions. Extruded products were characterized for damping properties. Damping capacity and dynamic modulus was measured as a function of time and temperature at a fixed frequency of 5 Hz 10 to 14% increase in damping capacity was observed in chip consolidated products compared to reference material. Microstructural changes after the temperature sweep tests were examined. Chip boundaries present in consolidated products were observed to suppress grain coarsening which otherwise was significant in reference material. The present work is significant from the viewpoint of recycling of machined chips and development of sustainable manufacturing processes. (C) 2012 Elsevier B.V. All rights reserved.

Item Type: Journal Article
Additional Information: Copyright of this article is belongs to Elsevier Science.
Keywords: Magnesium;Extrusion;Grain refinement;Damping capacity
Department/Centre: Division of Mechanical Sciences > Materials Engineering (formerly Metallurgy)
Date Deposited: 22 Aug 2012 04:30
Last Modified: 22 Aug 2012 04:32
URI: http://eprints.iisc.ernet.in/id/eprint/44445

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