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Microstructure and compression behavior of chip consolidated magnesium

Anilchandra, Adamane R and Basu, Ritwik and Samajdar, Indradev and Surappa, Mirle K (2012) Microstructure and compression behavior of chip consolidated magnesium. In: JOURNAL OF MATERIALS RESEARCH, 27 (4). pp. 709-719.

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Official URL: http://dx.doi.org/10.1557/jmr.2011.411

Abstract

Chips produced by turning a commercial purity magnesium billet were cold compacted and then hot extruded at four different temperatures: 250, 300, 350, and 400 degrees C. Cast billets, of identical composition, were also extruded as reference material. Chip boundaries, visible even after 49: 1 extrusion at 400 degrees C, were observed to suppress grain coarsening. Although 250 degrees C extruded chip-consolidated product showed early onset of yielding and lower ductility, fully dense material (extruded at 400 degrees C) had nearly 40% reduction in grain size with 22% higher yield strength and comparable ductility as that of the reference. The study highlights the role of densification and grain refinement on the compression behavior of chip consolidated specimens.

Item Type: Journal Article
Additional Information: Copyright Materials Research Society
Department/Centre: Division of Mechanical Sciences > Materials Engineering (formerly Metallurgy)
Date Deposited: 23 Jun 2012 06:23
Last Modified: 25 Jun 2012 09:39
URI: http://eprints.iisc.ernet.in/id/eprint/44637

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