Anilchandra, Adamane R and Basu, Ritwik and Samajdar, Indradev and Surappa, Mirle K (2012) Microstructure and compression behavior of chip consolidated magnesium. In: JOURNAL OF MATERIALS RESEARCH, 27 (4). pp. 709-719.
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Chips produced by turning a commercial purity magnesium billet were cold compacted and then hot extruded at four different temperatures: 250, 300, 350, and 400 degrees C. Cast billets, of identical composition, were also extruded as reference material. Chip boundaries, visible even after 49: 1 extrusion at 400 degrees C, were observed to suppress grain coarsening. Although 250 degrees C extruded chip-consolidated product showed early onset of yielding and lower ductility, fully dense material (extruded at 400 degrees C) had nearly 40% reduction in grain size with 22% higher yield strength and comparable ductility as that of the reference. The study highlights the role of densification and grain refinement on the compression behavior of chip consolidated specimens.
|Item Type:||Journal Article|
|Additional Information:||Copyright Materials Research Society|
|Department/Centre:||Division of Mechanical Sciences > Materials Engineering (formerly Metallurgy)|
|Date Deposited:||23 Jun 2012 06:23|
|Last Modified:||25 Jun 2012 09:39|
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