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Development of microstructure and texture in Copper during warm accumulative roll bonding

Suresh, KS and Sinha, Subhasis and Chaudhary, Abhishek and Suwas, Satyam (2012) Development of microstructure and texture in Copper during warm accumulative roll bonding. In: MATERIALS CHARACTERIZATION, 70 . pp. 74-82.

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Official URL: http://dx.doi.org/10.1016/j.matchar.2012.04.017

Abstract

The evolution of microstructure and texture gradient in warm Accumulative Roll Bonded Cu-Cu multilayer has been studied. Grain size distribution is multimodal and exhibits variation from middle to surface layer. Evolution of texture is largely influenced by shear, in addition to rolling deformation. This leads to the formation of a texture comprising of high fraction of Brass and rolling direction-rotated cube components. Partial recrystallization was observed. Deformed and recrystallized grains were separated using a partition scheme based on grain orientation spread and textures were analyzed for both the partition. Retention of deformation texture components in recrystallized grains suggests the mechanism of recrystallization as continuous recrystallization. Shear deformation plays an important role in grain refinement through continuous recrystallization. (C) 2012 Elsevier Inc. All rights reserved.

Item Type: Journal Article
Additional Information: Copyright for this article belongs to Elsevier Science
Keywords: Accumulative roll bonding; Texture heterogeneity; Grain refinement; Electron back scattered diffraction; Continuous recrystallization
Department/Centre: Division of Mechanical Sciences > Materials Engineering (formerly Metallurgy)
Date Deposited: 28 Aug 2012 06:47
Last Modified: 28 Aug 2012 06:47
URI: http://eprints.iisc.ernet.in/id/eprint/44974

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