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Comments on ``Effects of current density on the formation and microstructure of Sn-9Zn, Sn-8Zn-3Bi and Sn-3Ag-0.5Cu solder joints''

Paul, A and Laurila, T (2012) Comments on ``Effects of current density on the formation and microstructure of Sn-9Zn, Sn-8Zn-3Bi and Sn-3Ag-0.5Cu solder joints''. In: Intermetallics, 28 . pp. 164-165.

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Official URL: http://dx.doi.org/10.1016/j.intermet.2012.04.005

Abstract

Othman et al. (Intermetallics 2012;22:1-6) recently published a manuscript on ``Effects of current density on the formation and microstructure of Sn-9Zn, Sn-8Zn-3Bi and Sn-3Ag-0.5Cu solder joints''. We found problems in calculation of diffusion parameters. Even the comment on the formation of Cu5Zn8 instead of Cu6Sn5 is not correct. In this comment, we have explained the correct procedure to calculate the diffusion coefficients. Further, we have also explained the reason for the formation of Cu5Zn8 instead of Cu6Sn5 in the Cu/Sn-9Zn system. (C) 2012 Elsevier Ltd. All rights reserved.

Item Type: Editorials/Short Communications
Additional Information: Copyright for this article is belongs to Elsevier Science.
Keywords: Intermetallics;Diffusion
Department/Centre: Division of Mechanical Sciences > Materials Engineering (formerly Metallurgy)
Date Deposited: 22 Nov 2012 10:31
Last Modified: 22 Nov 2012 10:31
URI: http://eprints.iisc.ernet.in/id/eprint/45135

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