Suwas, Satyam and Suresh, KS and Rollett, AD (2012) Texture and microstructure evolution during cold rolling of Cu-Fe laminates prepared by accumulative roll bonding. In: 4th International Conference on Recrystallization and Grain Growth (ReX & GG 2010), JUL 04-09, 2010, Sheffield, ENGLAND, p. 170.
Full text not available from this repository.Abstract
Multi-layered materials have been made from Cu-Fe with approximately equal volume fractions using the Accumulated Roll Bonding (ARB) technique with less than 1 μm thickness of the individual layers. The so-obtained multi-layers have been subjected to deformation by cold rolling to 25, 50, 75, 87 and 93% reduction in thickness. A detailed characterization has been carried out using X-ray diffraction (line profile analysis and texture measurement) and electron (scanning and transmission) microscopy. It has been found that Fe layers are disintegrated whereas Cu retains its continuity within a layer. Microstructural Characterization from X-Ray Line profile Analysis (XRDLPA) through Variance Method reveals that large amount of strain is initially carried by Cu layers during deformation. In the Cu-Fe layer, the texture is comparatively weaker in Cu layer and strong in Fe layers. Brass Component increases up to 75% reduction and then decreases, while the ratio of Cu/S and Bs/S remains almost constant through out the deformation. After 50% reduction, dynamic recovery is predominant as indicated by the increase in the amount of low angle grain boundaries and decrease in dislocation density. The presence of R component indicates continuous dynamic recovery and recrystallization (CDRR) at the advanced stage of deformation.
| Item Type: | Conference Proceedings |
|---|---|
| Additional Information: | Copyright for this article belongs to TRANS TECH PUBLICATIONS LTD, SWITZERLAND |
| Department/Centre: | Division of Mechanical Sciences > Materials Engineering (formerly Metallurgy) |
| Date Deposited: | 11 Dec 2012 06:13 |
| Last Modified: | 11 Dec 2012 06:19 |
| URI: | http://eprints.iisc.ernet.in/id/eprint/45515 |
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