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A model of coupled thermal, mechanical, and electrostatic field effects in III-N thin film heterostructures

Shenoy, Bhamy Maithry and Mahapatra, Roy D and Hegde, Gopalkrishna (2013) A model of coupled thermal, mechanical, and electrostatic field effects in III-N thin film heterostructures. In: JOURNAL OF APPLIED PHYSICS, 114 (4).

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Official URL: http://dx.doi.org/10.1063/1.4816261

Abstract

A one-dimensional coupled multi-physics based model has been developed to accurately compute the effects of electrostatic, mechanical, and thermal field interactions on the electronic energy band structure in group III-nitrides thin film heterostructures. Earlier models reported in published literature assumes electro-mechanical field with uniform temperature thus neglecting self-heating. Also, the effects of diffused interface on the energy band structure were not studied. We include these effects in a self-consistent manner wherein the transport equation is introduced along with the electro-mechanical models, and the lattice structural variation as observed in experiments are introduced at the interface. Due to these effects, the electrostatic potential distribution in the heterostructure is altered. The electron and hole ground state energies decrease by 5% and 9%, respectively, at a relative temperature of 700 K, when compared with the results obtained from the previously reported electro-mechanical model assuming constant and uniform temperature distribution. A diffused interface decreases the ground state energy of electrons and holes by about 11% and 9%, respectively, at a relative temperature of 700 K when compared with the predictions based on uniform temperature based electro-mechanical model. (C) 2013 AIP Publishing LLC.

Item Type: Journal Article
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Additional Information: Copyright of this article is belongs to AMER INST PHYSICS
Department/Centre: Division of Mechanical Sciences > Aerospace Engineering (Formerly, Aeronautical Engineering)
Date Deposited: 01 Oct 2013 11:27
Last Modified: 01 Oct 2013 11:29
URI: http://eprints.iisc.ernet.in/id/eprint/47442

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