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Enhancement in Strain Hardening on Boron Addition in As-Cast Ti-6Al-4V Alloy

Agrawal, Priyanka and Karthikeyan, S (2015) Enhancement in Strain Hardening on Boron Addition in As-Cast Ti-6Al-4V Alloy. In: TRANSACTIONS OF THE INDIAN INSTITUTE OF METALS, 68 (2, SI). S195-S205.

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Official URL: http://dx.doi.org/10.1007/s12666-015-0560-6

Abstract

It has been previously reported that the addition of boron to Ti-6Al-4V results in significant refinement of the as-cast microstructure and enhancement in the strain hardening. However, the mechanism for the latter effect has not been adequately studied. The aim of this study was to understand the reasons for the enhancement in room temperature strain hardening on addition of boron to as cast Ti-6Al-4V alloy. A study was conducted on slip transmission using SEM, TEM, optical profilometry and four point probe resistivity measurements on un-deformed and deformed samples of Ti-6Al-4V-xB with five levels of boron. Optical profilometry was used to quantify the magnitude of offsets on slip traces which in turn provided information about the extent of planar or multiple slip. Studies on deformed samples reveal that while lath boundaries appear to easily permit dislocation slip transmission, colony boundaries are potent barriers to slip. From TEM studies it was also observed that while alloys containing lower boron underwent planar slip, deformation was more homogeneous in higher boron alloys due to multiple slip resulting from large number of colony boundaries. Multiple slip is also proposed to be the prime cause of the enhanced strain hardening.

Item Type: Journal Article
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Additional Information: Copy right for this article belongs to the SPRINGER INDIA, 7TH FLOOR, VIJAYA BUILDING, 17, BARAKHAMBA ROAD, NEW DELHI, 110 001, INDIA
Keywords: Slip trace; Strain hardening; Profilometry; Multiple slip; Planar slip
Department/Centre: Division of Mechanical Sciences > Materials Engineering (formerly Metallurgy)
Date Deposited: 24 Sep 2015 07:07
Last Modified: 24 Sep 2015 07:07
URI: http://eprints.iisc.ernet.in/id/eprint/52439

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