Rao, NJ and Rao, Ananda G (1999) A Course on Introduction to Electronic Packaging. In: 49th Electronic Components and Technology Conference, 1999, 1-4 June, San Diego,USA, 895 -898.
The translation of performance achievable on silicon to the system level requires the intervention of a high performance packaging technology. In high performance systems, the package is more than a mere provider of interconnections, mechanical support and protection. The package can and will actively influence the performance of the circuit and the system. With the lead times for introducing new products continuously getting reduced, it is necessary to manage the interface between the functional design and the package design at the board level. To manage this interface effectively, the electronics hardware designer needs to have a good appreciation of different aspects of packaging. This paper presents the case for a core course to the students of electrical and electronic engineering programme. Detailed syllabus, lecture plans and laboratory exercises related to the proposed course are presented. It is also suggested that a course of this nature should be created for web based instruction.
|Item Type:||Conference Paper|
|Additional Information:||Copyright 1990 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.|
|Department/Centre:||Division of Electrical Sciences > Electronic Systems Engineering (Formerly, (CEDT) Centre for Electronic Design & Technology)|
|Date Deposited:||07 Mar 2006|
|Last Modified:||19 Sep 2010 04:24|
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