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Studies on glow-discharge characteristics during dc reactive magnetron sputtering

Rao, Mohan G and Mohan, S (1991) Studies on glow-discharge characteristics during dc reactive magnetron sputtering. In: Journal of Applied Physics, 69 (9). pp. 6652-6655.

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Abstract

The process of reactive sputtering is influenced by reactive gas pressure and the rate of sputtering because the glow-discharge characteristics vary considerably in the presenceof reactive gas. The discharge characteristics during magnetron sputtering of copper in an argon and oxygen atmosphere have been investigated in the present study. The variation in the cathode potentials has been explained in terms of negative ion formation and target poisoning effects. It has been found that the rate of deposition and the oxygen partialpressure influence target poisoning, which in turn influences the discharge characteristics and rate of deposition. The properties of films deposited under different conditions have been correlated with the discharge characteristics and target poisoning.

Item Type: Journal Article
Additional Information: Copyright of this article belongs to American Institute of Physics.
Department/Centre: Division of Physical & Mathematical Sciences > Instrumentation and Applied Physics (Formally ISU)
Date Deposited: 15 Sep 2006
Last Modified: 19 Sep 2010 04:31
URI: http://eprints.iisc.ernet.in/id/eprint/8545

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