|Up a level|
Sundaram, Venky and Tummala, Rao and Wiedenman, Boyd and Liu, Fuhan and Raj, Markondeya P and Abothu, Isaac Robin and Bhattacharya, Swapan and Varadarajan, Mahesh and Bongio, Ed and Sherwood, Walt (2006) Recent Advances in Low CTE and High Density System-on-a-Package (SOP) Substrate with Thin Film Component Integration. In: 2006. Proceedings. 56th Electronic Components and Technology Conference, 2006, San Diego, CA.
Bhattacharya, Swapan and Pucha, Raghuram and Tummala, Rao and Sitaraman, Suresh and Varadarajan, Mahesh G and Lee, KJ (2006) Design, Fabrication and Reliability Assessment of Embedded Resistors and Capacitors in a Multilayered Organic Substrate with Microvias. In: Paper presented at the 4th Annual TECIT Conference of the Electrical Sciences Division of IISC,, 24 February 2006, IISc.
Varadarajan, Mahesh and Bhattacharya, Swapan and Doraiswami, Ravi and Rao, Ananda G and Rao, NJ and May, Gary and Conrad, Leyla and Tummala, Rao (2005) International Collaboration in Packaging Education: Hands-on System-on-Package (SOP) Graduate Level Courses at Indian Institute of Science and Georgia Tech PRC. In: Electronic Components and Technology, 2005. ECTC '05, May 31-Jun 4 2005, Lake Buena Vista,FL,United States, Vol.2 1930-1934.