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Number of items: 7.

Conference Proceedings

Talebanpour, B and Sahaym, U and Dutta, I and Kumar, P (2014) EFFECT OF AGING ON IMPRESSION CREEP BEHAVIOR OF Pb-FREE SOLDERS. In: ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, JUL 16-18, 2013, Burlingame, CA.

Conference Paper

Kumar, P and Talenbanpour, B and Sahaym, U and Wen, CH and Dutta, I (2012) Microstructural Evolution and Some Unusual Effects During Thermo-Mechanical Cycling of Sn-Ag-Cu Alloys. In: 13th IEEE InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) , MAY 30-JUN 01, 2012 , San Diego, CA , pp. 880-887.

Journal Article

Kumar, P and Dutta, I (2017) Response to ``Comment on `Electric current induced flow of liquid metals: Mechanisms and substrate-surface effects''' J. Appl. Phys. 121, 136102 (2017)]. In: JOURNAL OF APPLIED PHYSICS, 121 (13).

Huang, Z and Kumar, P and Dutta, I and Sidhu, R and Renavikar, M and Mahajan, R (2014) Effects of Microstructure and Loading on Fracture of Sn-3.8Ag-0.7Cu Joints on Cu Substrates with ENIG Surface Finish. In: JOURNAL OF ELECTRONIC MATERIALS, 43 (12). pp. 4485-4496.

Kumar, P and Howarth, J and Dutta, I (2014) Electric current induced flow of liquid metals: Mechanism and substrate-surface effects. In: JOURNAL OF APPLIED PHYSICS, 115 (4).

Huang, Z and Kumar, P and Dutta, I and Sidhu, R and Renavikar, M and Mahajan, R (2014) Incorporation of Interfacial Intermetallic Morphology in Fracture Mechanism Map for Sn-Ag-Cu Solder Joints. In: JOURNAL OF ELECTRONIC MATERIALS, 43 (1). pp. 88-95.

Huang, Z and Kumar, P and Dutta, I and Pang, JHL and Sidhu, R (2014) A general methodology for calculating mixed mode stress intensity factors and fracture toughness of solder joints with interfacial cracks. In: ENGINEERING FRACTURE MECHANICS, 131 . pp. 9-25.

This list was generated on Sat Sep 21 16:37:32 2019 IST.