ePrints@IIScePrints@IISc Home | About | Browse | Latest Additions | Advanced Search | Contact | Help

Browse by Author

Up a level
Export as [feed] Atom [feed] RSS 1.0 [feed] RSS 2.0
Group by: Item Type | No Grouping
Number of items: 1.

Journal Article

Joseph, Shany and Phatak, Girish J and Gurunathan, K and Seth, Tanay and Amalnerkar, DP and Kutty, TRN (2006) Electrochemical co-deposition of ternary Sn-Bi-Cu films for solder bumping applications. In: Journal Of Applied Electrochemistry, 36 (8). pp. 907-912.

This list was generated on Fri Oct 31 00:25:55 2014 IST.