|Up a level|
Rao, BS and Hemambar, C and Pathak, AV and Patel, KJ and Rodel, J and Jayaram, V (2006) Al/SiC carriers for microwave integrated circuits by a new technique of pressureless infiltration. In: IEEE Transactions on Electronics Packaging Manufacturing, 29 (1). pp. 58-63.
Hemambar, C and Rao, Srinivasa B and Jayaram, V (2001) Al-SiC electronic packages with controlled thermal expansion coefficient by a new method of pressureless infiltration. In: Materials and Manufacturing Processes, 16 (6). pp. 779-788.