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Journal Article

Sharma, Deepak and Jain, Aman and Somaiah, Nalla and Narayanan, P Ramesh and Kumar, Praveen (2018) Effect of Embedding Cu-Graphene Hybrid Powder into 2-Phase In-Cu Solders on Its Suitability as Metallic Thermal Interface Material. In: JOURNAL OF ELECTRONIC MATERIALS, 47 (8). pp. 4863-4874.

This list was generated on Fri Oct 18 02:06:19 2019 IST.