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Number of items: 3.

Journal Article

Kanjilal, Anwesha and Kumar, Praveen (2018) Growth of Interfacial Intermetallic Compound Layer in Diffusion-Bonded SAC-Cu Solder Joints During Different Types of Thermomechanical Excursion. In: JOURNAL OF ELECTRONIC MATERIALS, 47 (1). pp. 457-469.

Kanjilal, Anwesha and Jangid, Vikas and Kumar, Praveen (2017) Critical evaluation of creep behavior of Sn-Ag-Cu solder alloys over wide range of temperatures. In: MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 703 . pp. 144-153.

Ghosh, Rituparna and Kanjilal, Anwesha and Kumar, Praveen (2017) Effect of type of thermo-mechanical excursion on growth of interfacial intermetallic compounds in Cu/Sn-Ag-Cu solder joints. In: MICROELECTRONICS RELIABILITY, 74 . pp. 44-51.

This list was generated on Mon Oct 14 20:12:49 2019 IST.