ePrints@IIScePrints@IISc Home | About | Browse | Latest Additions | Advanced Search | Contact | Help

Browse by Author

Up a level
Export as [feed] Atom [feed] RSS 1.0 [feed] RSS 2.0
Group by: Item Type | No Grouping
Number of items: 2.

Journal Article

Laurila, T and Karppinen, J and Vuorinen, V and Li, J and Paul, A and Paulasto-Krockel, M (2012) Effect of isothermal aging and electromigration on the microstructural evolution of solder interconnections during thermomechanical loading. In: Journal of Electronic Materials, 41 (11). pp. 3179-3195.

Laurila, T and Karppinen, J and Vuorinen, V and Paul, A and Paulasto-Krockel, M (2011) Effect of Constant and Cyclic Current Stressing on the Evolution of Intermetallic Compound Layers. In: Journal of Electronic Materials, 40 (7). pp. 1517-1526.

This list was generated on Mon Oct 20 14:33:53 2014 IST.