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Conference Proceedings

Krishna, N P Vamsi and Sen, Prosenjit (2017) Die Level 3D Heterogeneous Integration of a Microfluidic System. In: 19th IEEE Electronics Packaging Technology Conference (EPTC), DEC 06-09, 2017, Singapore, SINGAPORE.

Krishna, N P Vamsi and Ramesh, Nayana and Mohan, Nagaboopathy and Muralidharan, Rangarajan and Raghavan, Srinivasan and Nath, Digbijoy N and Sen, Prosenjit (2017) Gallium Nitride transistor on glass using epoxy mediated substrate transfer technology. In: 19th IEEE Electronics Packaging Technology Conference (EPTC), DEC 06-09, 2017, Singapore, SINGAPORE.

This list was generated on Mon Oct 21 10:26:45 2019 IST.