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Journal Article

Laurila, T and Karppinen, J and Vuorinen, V and Li, J and Paul, A and Paulasto-Krockel, M (2012) Effect of isothermal aging and electromigration on the microstructural evolution of solder interconnections during thermomechanical loading. In: Journal of Electronic Materials, 41 (11). pp. 3179-3195.

Unocic, RR and Viswanathan, GB and Sarosi, PM and Karthikeyan, S and Li, J and Mills, MJ (2008) Mechanisms of creep deformation in polycrystalline Ni-base disk superalloys. In: Materials Science and Engineering: A, 483-48 . pp. 25-32.

This list was generated on Sun Jan 21 08:54:46 2018 IST.