Number of items: 2.
Journal Article
Laurila, T and Karppinen, J and Vuorinen, V and Li, J and Paul, A and Paulasto-Krockel, M
(2012)
Effect of isothermal aging and electromigration on the microstructural evolution of solder interconnections during thermomechanical loading.
In: Journal of Electronic Materials, 41
(11).
pp. 3179-3195.
Unocic, RR and Viswanathan, GB and Sarosi, PM and Karthikeyan, S and Li, J and Mills, MJ
(2008)
Mechanisms of creep deformation in polycrystalline Ni-base disk superalloys.
In: Materials Science and Engineering: A, 483-48
.
pp. 25-32.
This list was generated on Sat May 18 08:15:13 2013 IST.
