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Journal Article

Huang, Z and Kumar, P and Dutta, I and Sidhu, R and Renavikar, M and Mahajan, R (2014) Effects of Microstructure and Loading on Fracture of Sn-3.8Ag-0.7Cu Joints on Cu Substrates with ENIG Surface Finish. In: JOURNAL OF ELECTRONIC MATERIALS, 43 (12). pp. 4485-4496.

Huang, Z and Kumar, P and Dutta, I and Sidhu, R and Renavikar, M and Mahajan, R (2014) Incorporation of Interfacial Intermetallic Morphology in Fracture Mechanism Map for Sn-Ag-Cu Solder Joints. In: JOURNAL OF ELECTRONIC MATERIALS, 43 (1). pp. 88-95.

This list was generated on Thu Sep 19 09:39:42 2019 IST.