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Number of items: 4.

Conference Proceedings

Nayak, Bibhu Prasad and Vedicherla, Sreenivasulu Reddy and Gope, Dipanjan (2017) Directional Hybrid FEM-MoM for Automotive System level Simulation. In: 25th IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), OCT 23-26, 2016, San Diego, CA, pp. 169-171.

Nayak, Bibhu Prasad and Vedicherla, Sreenivasulu Reddy and Gope, Dipanjan (2016) Extension of 2.5D PEEC for Coplanar Structures in Power Distribution Network Analysis. In: IEEE 20th Workshop on Signal and Power Integrity (SPI), MAY 08-11, 2016, Turin, ITALY.

Nayak, Bibhu Prasad and Vedicherla, Sreenivasulu Reddy and Gope, Dipanjan (2015) Non-orthogonal 2.5D PEEC for Power Integrity Analysis. In: IEEE Electrical Design of Advanced Packaging, DEC 14-16, 2015, Seoul, SOUTH KOREA, pp. 174-177.

Journal Article

Nayak, Bibhu Prasad and Vedicherla, Sreenivasulu Reddy and Gope, Dipanjan (2017) Nonorthogonal 2.5-D PEEC for Power Integrity Analysis of Package-Board Geometries. In: IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 65 (4). pp. 1203-1214.

This list was generated on Thu Sep 21 23:49:48 2017 IST.