ePrints@IIScePrints@IISc Home | About | Browse | Latest Additions | Advanced Search | Contact | Help

Browse by Author

Up a level
Export as [feed] Atom [feed] RSS 1.0 [feed] RSS 2.0
Group by: Item Type | No Grouping
Number of items: 1.

Conference Paper

Varadarajan, Mahesh G and Lee, Kang J and Bhattacharya, Swapan K and Bliattachaijee, Ajanta and Wan, Lixi and Pucha, Raghuram and Tummala, Rao R and Sitaraman, Suresh (2006) Studies on design, fabrication and reliability assessment of embedded passives on a high-density interconnect (HDI) organic substrate using a sequential build-up process. In: th IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP 06), Jun 27, 2005-Jun 30, 2006, Shanghai, pp. 98-108.

This list was generated on Fri Dec 26 18:11:01 2014 IST.