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Sundaram, Venky and Tummala, Rao and Wiedenman, Boyd and Liu, Fuhan and Raj, Markondeya P and Abothu, Isaac Robin and Bhattacharya, Swapan and Varadarajan, Mahesh and Bongio, Ed and Sherwood, Walt (2006) Recent Advances in Low CTE and High Density System-on-a-Package (SOP) Substrate with Thin Film Component Integration. In: 2006. Proceedings. 56th Electronic Components and Technology Conference, 2006, San Diego, CA.